• DocumentCode
    604873
  • Title

    Experimental characterization of cold aisle containment for data centers

  • Author

    Sundaralingam, V. ; Arghode, V.K. ; Joshi, Yash

  • Author_Institution
    G.W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    223
  • Lastpage
    230
  • Abstract
    The data center industry has experienced significant growth over the last decade, mainly due to the increased use of the internet for our day to day activities such as e-commerce, social media, video streaming and healthcare. This growth in demand results in higher energy costs, as data centers can be energy intensive facilities. A significant portion of the energy used in data centers is for cooling purposes. Hence, it is one of the important areas of optimization to be addressed to create more efficient data centers. Amongst the many ways to increase data center efficiencies, airflow management is a key solution to many existing data centers. Fundamentally, there are three main schemes: hot-aisle containment, cold-aisle containment and exhaust chimney containment. This paper´s focus is to experimentally characterize the following cold aisle configurations: open aisle, partially contained aisle and fully contained aisles. Experimental data presented to evaluate the effectiveness of the different configurations are rack inlet contour plots, tile and rack flow rates, pressure measurements, and server CPU temperatures.
  • Keywords
    DP industry; computer centres; demand side management; energy conservation; Internet; airflow management; cold aisle containment; data center efficiencies; data center industry; energy costs; energy demand; pressure measurements; rack inlet contour plots; server CPU temperatures; Fluid flow measurement; Heating; Servers; Temperature distribution; Temperature measurement; Temperature sensors; Uncertainty; aisle; cold; containment; data center; experimental;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-6427-0
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2013.6526833
  • Filename
    6526833