DocumentCode :
604873
Title :
Experimental characterization of cold aisle containment for data centers
Author :
Sundaralingam, V. ; Arghode, V.K. ; Joshi, Yash
Author_Institution :
G.W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2013
fDate :
17-21 March 2013
Firstpage :
223
Lastpage :
230
Abstract :
The data center industry has experienced significant growth over the last decade, mainly due to the increased use of the internet for our day to day activities such as e-commerce, social media, video streaming and healthcare. This growth in demand results in higher energy costs, as data centers can be energy intensive facilities. A significant portion of the energy used in data centers is for cooling purposes. Hence, it is one of the important areas of optimization to be addressed to create more efficient data centers. Amongst the many ways to increase data center efficiencies, airflow management is a key solution to many existing data centers. Fundamentally, there are three main schemes: hot-aisle containment, cold-aisle containment and exhaust chimney containment. This paper´s focus is to experimentally characterize the following cold aisle configurations: open aisle, partially contained aisle and fully contained aisles. Experimental data presented to evaluate the effectiveness of the different configurations are rack inlet contour plots, tile and rack flow rates, pressure measurements, and server CPU temperatures.
Keywords :
DP industry; computer centres; demand side management; energy conservation; Internet; airflow management; cold aisle containment; data center efficiencies; data center industry; energy costs; energy demand; pressure measurements; rack inlet contour plots; server CPU temperatures; Fluid flow measurement; Heating; Servers; Temperature distribution; Temperature measurement; Temperature sensors; Uncertainty; aisle; cold; containment; data center; experimental;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4673-6427-0
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/SEMI-THERM.2013.6526833
Filename :
6526833
Link To Document :
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