DocumentCode :
604877
Title :
Thermal transient characterization of semiconductor devices with programmed powering
Author :
Farkas, Gabor
Author_Institution :
Mech. Anal. Div., Mentor Graphics, Budapest, Hungary
fYear :
2013
fDate :
17-21 March 2013
Firstpage :
248
Lastpage :
255
Abstract :
Thermal transient testing of semiconductor devices typically needs a well defined power level for heating and a proper data acquisition equipment for recording the change of a thermally sensitive device parameter. While the latter is fully solved by up-to-date thermal testers, power level setting is typically limited to defining a current level for two pin devices (diodes). Other proposed methods need trials for setting the power and have poor stability. The paper presents a methodology for applying power on devices with three pins, such as MOSFETs, IGBTs, BJTs and HEMTs. A simple analog circuitry is proposed which ensures thermally and electrically stable powering and an exact operating voltage and current.
Keywords :
MOSFET; bipolar transistors; high electron mobility transistors; insulated gate bipolar transistors; semiconductor device testing; BJT; HEMT; IGBT; MOSFET; analog circuitry; data acquisition equipment; pin device; power level setting; programmed powering; semiconductor device; thermal tester; thermal transient characterization; thermal transient testing; thermally sensitive device parameter; Logic gates; MOSFET; Temperature; Temperature sensors; Testing; Thermal stability; Transient analysis; HEMT; IGBT; MOSFET; Thermal testing; bipolar transistor; power semiconductor devices; transient testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4673-6427-0
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/SEMI-THERM.2013.6526837
Filename :
6526837
Link To Document :
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