Thermal-mechanical design of sandwich SiC power module with micro-channel cooling

Author

Shan Yin ; Tseng, King-Jet ; Jiyun Zhao

Author_Institution

Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore

fYear

2013

fDate

22-25 April 2013

Firstpage

535

Lastpage

540

Abstract

A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) flows in opposite directions in the two heat sinks. Compared with wirebonding packaging, the proposed sandwich structure can almost double the cooling efficiency (thermal resistance 0.11 K/W) and temperature-distribution uniformity. Finite element analysis of thermal stress was further carried out to check that the CTE mismatch in the packaging has been minimized.

Keywords

computational fluid dynamics; coolants; cooling; finite element analysis; heat sinks; hybrid electric vehicles; modules; sandwich structures; silicon compounds; temperature distribution; thermal stresses; wide band gap semiconductors; CFD; CTE; DBC substrate; HEV application; SiC; back Cu-layer; double side cooling; finite element analysis; liquid coolant; microchannel cooling; microchannel heat sink; sandwich SiC power module; sandwich packaging structure; thermal stress; thermal-mechanical design; uniform temperature distribution; Electronic packaging thermal management; MOSFET; Packaging; Silicon carbide; Stress; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Drive Systems (PEDS), 2013 IEEE 10th International Conference on

Conference_Location

Kitakyushu

ISSN

2164-5256

Print_ISBN

978-1-4673-1790-0

Electronic_ISBN

2164-5256

Type

conf

DOI

10.1109/PEDS.2013.6527077

Filename

6527077