Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power

Author

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Vairavan, Rajendaran ; Haimi, W.M.W.N. ; Kamarudin, H. ; Neoh Fung Yih ; Khalid, N.

Author_Institution

Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia

fYear

2013

fDate

10-12 April 2013

Firstpage

290

Lastpage

293

Abstract

LEDs are being utilized as lighting source due to its superior advantages over incandescent lamps in terms of higher efficiency, brighter light emission and longer lifetime. However, the reliability and efficiency of the LED is dependent on the junction temperature of the LED chip. Hence, the heat dissipation of single chip LED package with aluminum heat slug was investigated through simulation in this study .The heat dissipation was evaluated in terms of junction temperature. The single chip LED was powered with input power of 0.1W and 1W. The Von Mises stress of the LED chip at both input power was evaluated. The maximum junction temperature of the LED at steady state is 119.43°C at input power of 1W.

Keywords

LED lamps; aluminium; cooling; electronics packaging; filament lamps; lighting; semiconductor device reliability; Al; LED chip; Von Mises stress; aluminum heat slug; heat dissipation; incandescent lamps; junction temperature; lighting source; reliability; single chip LED package; solid state lighting stress; temperature 119.43 degC; Electronic packaging thermal management; Heating; Junctions; Light emitting diodes; Reliability; Steady-state; Stress; single chip LED; aluminum heat slug; junction temperature; ansys;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on

Conference_Location

Cambridge

Print_ISBN

978-1-4673-6421-8

Type

conf

DOI

10.1109/UKSim.2013.127

Filename

6527430