Stress and Temperature Simulation Using Copper-Diamond Composite Slug

Author

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Vairavan, Rajendaran ; Ismail, R.C. ; Khalid, N. ; Husin, M.F.C. ; Kamarudin, H.

Author_Institution

Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia

fYear

2013

fDate

10-12 April 2013

Firstpage

299

Lastpage

303

Abstract

A revolution to illumination industry, the high power light emitting diodes, LEDs have significant dominance in terms of optical performance, low power consumption and superior reliability over conventional lights. In spite of that the junction temperature of the LED is an imperative aspect which manipulates the consistency of the LED. This study discusses the thermal and stress analysis of single chip LED package with copper diamond heat slug. The simulation was carried out using Ansys version 11. In this simulation, input power of 0.1W and 1W were applied to the LED chip. The key findings of this study exhibited that the max junction temperature of 113.13 °C and stress of 116.36 MPa were gained.

Keywords

copper; light emitting diodes; stress analysis; thermal analysis; Ansys version 11; copper diamond heat slug; copper-diamond composite slug; high power light emitting diode; illumination industry; junction temperature; optical performance; power 0.1 W; power 1 W; power consumption; single chip LED package; stress analysis; stress simulation; temperature 113.13 C; temperature simulation; thermal analysis; Heat sinks; Heating; Junctions; Light emitting diodes; Reliability; Stress; Thermal analysis; single chip LED;copper diamond heat slug; ansys;junction temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on

Conference_Location

Cambridge

Print_ISBN

978-1-4673-6421-8

Type

conf

DOI

10.1109/UKSim.2013.151

Filename

6527432