• DocumentCode
    605303
  • Title

    Microcontact printing using flexible flat PDMS stamps with metal embedment

  • Author

    Ikjoo Byun ; Jongho Park ; Beomjoon Kim

  • Author_Institution
    CIRMM, Univ. of Tokyo, Tokyo, Japan
  • fYear
    2012
  • fDate
    16-19 Oct. 2012
  • Firstpage
    30
  • Lastpage
    33
  • Abstract
    This paper reports a microcontact printing (μCP) using flexible flat polydimethylsiloxane (PDMS) stamps with metal embedment. In conventional μCP process, self-assembled monolayer (SAM) ink can be transferred by conformal contact between a structural PDMS stamp and a substrate. In our research we utilized that hexadecanethiol (HDT), one of SAM ink molecules for μCP, can be soaked to the PDMS, but not to the Cr layer. Based on this fact, the PDMS with Cr embedment was used as a stamp for μCP even though there is `no structural tip´ (i.e. flat) in PDMS stamps. The new stamps for μCP have no mechanical deformation of stamps´ tip which is crucial problem of conventional PDMS stamps during μCP. Moreover, there are several advantages compared to other flat PDMS stamps, such as no limitation of lifetime and no contamination problem during fabrication process.
  • Keywords
    contamination; polymer blends; self-assembly; soft lithography; HDT; SAM ink molecules; conformal contact; contamination problem; conventional μCP process; conventional PDMS stamps; fabrication process; flexible flat PDMS stamps; flexible flat polydimethylsiloxane stamps; hexadecanethiol; mechanical deformation; metal embedment; microcontact printing; self-assembled monolayer ink; structural PDMS stamp; Dry lift-off process; Microcontact printing (μCP); Self-assembled monolayer (SAM); Surface modification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference (NMDC), 2012 IEEE
  • Conference_Location
    Waikiki Beach, HI
  • Print_ISBN
    978-1-4673-2871-5
  • Type

    conf

  • DOI
    10.1109/NMDC.2012.6527585
  • Filename
    6527585