DocumentCode
605303
Title
Microcontact printing using flexible flat PDMS stamps with metal embedment
Author
Ikjoo Byun ; Jongho Park ; Beomjoon Kim
Author_Institution
CIRMM, Univ. of Tokyo, Tokyo, Japan
fYear
2012
fDate
16-19 Oct. 2012
Firstpage
30
Lastpage
33
Abstract
This paper reports a microcontact printing (μCP) using flexible flat polydimethylsiloxane (PDMS) stamps with metal embedment. In conventional μCP process, self-assembled monolayer (SAM) ink can be transferred by conformal contact between a structural PDMS stamp and a substrate. In our research we utilized that hexadecanethiol (HDT), one of SAM ink molecules for μCP, can be soaked to the PDMS, but not to the Cr layer. Based on this fact, the PDMS with Cr embedment was used as a stamp for μCP even though there is `no structural tip´ (i.e. flat) in PDMS stamps. The new stamps for μCP have no mechanical deformation of stamps´ tip which is crucial problem of conventional PDMS stamps during μCP. Moreover, there are several advantages compared to other flat PDMS stamps, such as no limitation of lifetime and no contamination problem during fabrication process.
Keywords
contamination; polymer blends; self-assembly; soft lithography; HDT; SAM ink molecules; conformal contact; contamination problem; conventional μCP process; conventional PDMS stamps; fabrication process; flexible flat PDMS stamps; flexible flat polydimethylsiloxane stamps; hexadecanethiol; mechanical deformation; metal embedment; microcontact printing; self-assembled monolayer ink; structural PDMS stamp; Dry lift-off process; Microcontact printing (μCP); Self-assembled monolayer (SAM); Surface modification;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology Materials and Devices Conference (NMDC), 2012 IEEE
Conference_Location
Waikiki Beach, HI
Print_ISBN
978-1-4673-2871-5
Type
conf
DOI
10.1109/NMDC.2012.6527585
Filename
6527585
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