DocumentCode
605519
Title
A novel silicon interposer for measuring devices requiring complex two-sided contacting
Author
Derakhshandeh, J. ; Golshani, Negin ; Steenweg, L.A. ; van der Vlist, W. ; Nanver, Lis K.
Author_Institution
DIMES, Delft Univ. of Technol., Delft, Netherlands
fYear
2013
fDate
25-28 March 2013
Firstpage
43
Lastpage
46
Abstract
The design and fabrication process is presented for a novel silicon-based interposer suitable for dies where it is necessary to place multiple contact pads on the both sides of wafer. This interposer transfers all contacts to the same side of the wafer so that the measurement can be done using conventional probe stations for one-sided probing.
Keywords
electrical contacts; elemental semiconductors; integrated circuit packaging; photodetectors; photodiodes; probes; silicon; Si; complex two-sided contacting; fabrication process; measuring devices; multiple contact pads; one-sided probing; photodiode detector; probe stations; silicon interposer; wafer; Contacts; Electric variables measurement; Etching; Layout; Probes; Silicon; Wires; Double sided probing; Photodiode detector; Silicon DRIE; Silicon interposer;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on
Conference_Location
Osaka, Japan
ISSN
1071-9032
Print_ISBN
978-1-4673-4845-4
Electronic_ISBN
1071-9032
Type
conf
DOI
10.1109/ICMTS.2013.6528143
Filename
6528143
Link To Document