Title :
A novel mechanism to construct a compatible overlay on heterogeneous mobile peers
Author :
Chuan-Chi Lai ; Chuan-Ming Liu ; Ying-Chi Su
Author_Institution :
Comp. Sci. & Inf. Eng., Nat. Taipei Univ. of Tech., Taipei, Taiwan
Abstract :
As the mobile computing environment emerges, people can use different mobile devices to access information ubiquitously. This has shifted the researchers´ sights to Mobile P2P (MP2P) systems, where the membership among peers is more dynamic and ad hoc. In the ubiquitous environments, the mobile devices generally are heterogeneous. In this paper, we consider the MP2P systems where the mobile peers are heterogeneous and propose a mechanism, named Heterogeneity-aware Overlay Technique (HOT), to build up an unstructured overlay. The proposed mechanism considers the overall ability, including power, network, CPU, and memory to set up the overlay. An ability equation is thus defined and the resulting overlay can ensure a good quality of service while the topology mismatching problem is alleviated. Last, we present our simulation for the proposed mechanism and compare the results with other related approaches. The simulation result shows that our proposed mechanism can effectively achieve a better service quality and mitigate the topology mismatching problem.
Keywords :
mobile computing; mobile radio; overlay networks; peer-to-peer computing; quality of service; telecommunication network topology; CPU; HOT; MP2P system; ability equation; compatible overlay; heterogeneity-aware overlay technique; heterogeneous mobile peers; information access; memory; mobile P2P system; mobile computing environment; mobile device; network; peers membership; power; quality of service; topology mismatching problem; ubiquitous environment; Delays; Mathematical model; Mobile communication; Mobile handsets; Network topology; Peer-to-peer computing; Topology; MP2P; heterogeneous; topology mismatching; ubiquitous;
Conference_Titel :
Pervasive Computing and Communications Workshops (PERCOM Workshops), 2013 IEEE International Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-5075-4
Electronic_ISBN :
978-1-4673-5076-1
DOI :
10.1109/PerComW.2013.6529460