“Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys”

Author

Eckermann, J. ; Mehmood, Shahid ; Davies, H.M. ; Lavery, N.P. ; Brown, S.G.R. ; Sienz, J. ; Jones, Andrew ; Sommerfeld, P.

fYear

2013

fDate

14-17 April 2013

Firstpage

1

Lastpage

8

Abstract

The aim of this investigation was to understand the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (-40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand´s viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson pr°Cedures.

Keywords

creep; fatigue; solders; Anand viscoplasticity model; computational modelling; constitutive equation; creep based fatigue; fatigue behaviour; joint assembly; lead free solder alloy; lifetime predictions; solder joints; temperature fluctuation; thermal power cycle; Abstracts; Computational modeling; Copper; Finite element analysis; Lead; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Conference_Location

Wroclaw

Print_ISBN

978-1-4673-6138-5

Type

conf

DOI

10.1109/EuroSimE.2013.6529901

Filename

6529901