• DocumentCode
    606842
  • Title

    Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength

  • Author

    Hartmann, Steve ; Holck, O. ; Wunderle, B.

  • Author_Institution
    Dept. Mater. & Reliability of Microsyst., Univ. of Technol., Chemnitz, Germany
  • fYear
    2013
  • fDate
    14-17 April 2013
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    CNT/metal interfaces under mechanical loads are investigated using molecular dynamics by simulating pull-out tests of single walled carbon nanotubes (CNTs) emdedded in single crystal gold lattices. As a result of our simulations we present obtained force-displacement data. We investigated the influence of two different Lennard Jones (LJ) coefficients pairs, two CNT types and three lattice directions of the gold matrix with respect to the embedding direction. Additionally we incorporated structural defects into our model and report on their influence. The change of the CNT type leads to a change in the maximum pull-out force. Here we attribute this to the change in CNT diameter, where a bigger diameter entails an increased maximum pull-out force. Changing the LJ coefficient pair has a strong impact on the maximum pull-out forces, where a higher bonding energy results in a higher maximum pull-out force. Defects also show a positive effect on the maximum pull-out force. The presented results have impact on bonding strength of CNT/metal interfaces.
  • Keywords
    bonding processes; carbon nanotubes; CNT diameter; CNT metal interface; CNT/gold interface; CNT/metal interface; LJ coefficient pair; Lennard Jones coefficient pairs; bonding strength; embedding direction; force displacement data; gold matrix; maximum pull out force; molecular dynamics simulation; pull out test; single crystal gold lattice; single walled carbon nanotubes; three lattice direction; Abstracts; Carbon; Force; Frequency modulation; Mechanical systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
  • Conference_Location
    Wroclaw
  • Print_ISBN
    978-1-4673-6138-5
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2013.6529903
  • Filename
    6529903