• DocumentCode
    606897
  • Title

    Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations

  • Author

    Holck, O. ; Bauer, J. ; Braun, Torsten ; Walter, Hans ; Wittler, Olaf ; Wunderle, B. ; Lang, K.D.

  • Author_Institution
    Fraunhofer Inst. for Reliability & Microintegration (IZM), Berlin, Germany
  • fYear
    2013
  • fDate
    14-17 April 2013
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    We have investigated the capability to predict moisture induced swelling of an epoxy by use of molecular dynamics in combination with finite element simulations with well agreeing results. Some open questions remain regarding reproducability, structural validity of molecular models and equilibrium conditions and structural acuracy and influence on the results, which will be subject of future investigations. But promising first results could be achieved which advance the understanding of the phenomenon of moisture induced swelling. Results on an investigation of enhanced transport at the interface showed a significant impact of swelling on the stresses at the interface, but only little influence on the concentration profile in the bulk. The discussion of the reasons may spark further experimental and simulative investigations to better understand mechanisms of moisture transport and swelling.
  • Keywords
    finite element analysis; molecular dynamics method; moulding; semiconductor device models; concentration profile; epoxy; finite element simulations; microelectronics devices; moisture induced swelling swelling; moisture transport; molecular dynamics; molecular modeling; moulding-compound substrate interfaces; swelling stresses; Kinetic theory; Lead; Moisture; Software; Solid modeling; Solids; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
  • Conference_Location
    Wroclaw
  • Print_ISBN
    978-1-4673-6138-5
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2013.6529958
  • Filename
    6529958