• DocumentCode
    606906
  • Title

    Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments

  • Author

    Schondelmaier, G. ; Hartmann, Steve ; May, Dominik ; Shaporin, A. ; Voigt, Stefan ; Rodriguez, R.D. ; Gordan, Ovidiu Dorin ; Zahn, Dietrich R. T. ; Mehner, J. ; Hiller, K. ; Wunderle, B.

  • Author_Institution
    Dept. Mater. & Reliability of Microsyst., Tech. Univ. Chemnitz, Chemnitz, Germany
  • fYear
    2013
  • fDate
    14-17 April 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.
  • Keywords
    bonding processes; force sensors; piezoresistive devices; silicon-on-insulator; sputter etching; MEMS; SOI wafers; bonding and deep reactive ion etching; nano-Newton force piezoresistive sensor; nano-Newton resolution; nanostructured materials; nanosystems manipulation; piezoresistive force sensor; piezoresistive load sensor; tensile testing system; thermal actuators; Abstracts; Analytical models; Heating; Micromechanical devices; Predictive models; Reliability; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
  • Conference_Location
    Wroclaw
  • Print_ISBN
    978-1-4673-6138-5
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2013.6529967
  • Filename
    6529967