DocumentCode
606909
Title
Low cycle fatigue measurement results on real flip chip solder contacts
Author
Metasch, R. ; Roellig, M. ; Roehsler, A. ; Boehm, Christoph ; Wolter, Katinka
Author_Institution
Fraunhofer Inst. for Non-Destruct. Testing, Dresden, Germany
fYear
2013
fDate
14-17 April 2013
Firstpage
1
Lastpage
6
Abstract
The paper presents low cycle fatigue results and properties as measured by small solder joints in a shear test setup. These symmetrical triangle experiments were performed at 25 °C by the variation of the specimen´s displacements and the solder joint materials. The displacements varied between 2 μm and 8 μm to get strains up to 2 % and stresses up to 40 MPa. The used solder ball alloys are SnAg3.5, SnAg3.0Cu0.75 and SnPb36. The strain rate was close to 1E-2 per second.
Keywords
copper alloys; fatigue; flip-chip devices; lead alloys; silver alloys; solders; tin alloys; SnAg; SnAgCu; SnPb; flip chip solder contacts; low cycle fatigue measurement; shear test setup; solder joint material; specimen displacement; temperature 25 C; Abstracts; Aluminum; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location
Wroclaw
Print_ISBN
978-1-4673-6138-5
Type
conf
DOI
10.1109/EuroSimE.2013.6529970
Filename
6529970
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