Title :
Low cycle fatigue measurement results on real flip chip solder contacts
Author :
Metasch, R. ; Roellig, M. ; Roehsler, A. ; Boehm, Christoph ; Wolter, Katinka
Author_Institution :
Fraunhofer Inst. for Non-Destruct. Testing, Dresden, Germany
Abstract :
The paper presents low cycle fatigue results and properties as measured by small solder joints in a shear test setup. These symmetrical triangle experiments were performed at 25 °C by the variation of the specimen´s displacements and the solder joint materials. The displacements varied between 2 μm and 8 μm to get strains up to 2 % and stresses up to 40 MPa. The used solder ball alloys are SnAg3.5, SnAg3.0Cu0.75 and SnPb36. The strain rate was close to 1E-2 per second.
Keywords :
copper alloys; fatigue; flip-chip devices; lead alloys; silver alloys; solders; tin alloys; SnAg; SnAgCu; SnPb; flip chip solder contacts; low cycle fatigue measurement; shear test setup; solder joint material; specimen displacement; temperature 25 C; Abstracts; Aluminum; Stress;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4673-6138-5
DOI :
10.1109/EuroSimE.2013.6529970
