• DocumentCode
    606910
  • Title

    Design of SiGe Nano-Electromechanical relays for logic applications

  • Author

    Rochus, Veronique ; Ramezani, Mahdi ; Cosemans, S. ; Severi, Simone ; Witvrouw, A. ; De Meyer, K. ; Tilmans, Harrie A. C. ; Rottenberg, Xavier

  • Author_Institution
    Imec, Leuven, Belgium
  • fYear
    2013
  • fDate
    14-17 April 2013
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This paper presents a design approach for Nano-ElectroMechanical Structures (NEMS) relays taking Casimir or van der Waals forces into account for the static and dynamic modeling of the devices. The goal is to design these structures using the Poly Silicon Germanium process, with several fabrication constraints on the gap, the structure thickness and the critical dimensions. The design approach starts with an analytical study taking the general expression for adhesion forces into account. Considering the van der Waals forces, finite element simulations performed on a simple cantilever confirm these analytical results. More complex structures are then designed, such as cantilevers with larger plates and torsion actuators, in order to increase the performance of the devices and to avoid permanent stiction. Inverters as well as NAND gates are designed and optimized to reach CMOS-equivalent specifications and finally a ring oscillator based on the new inverter and NAND gate is proposed.
  • Keywords
    CMOS logic circuits; Ge-Si alloys; cantilevers; finite element analysis; logic design; logic gates; nanoelectromechanical devices; oscillators; stiction; CMOS-equivalent specifications; Casimir force; NAND gates; NEMS relays; adhesion forces; design approach; device dynamic modeling; fabrication constraint; finite element simulations; inverters; logic applications; polysilicon germanium process; ring oscillator; silicon germanium nanoelectromechanical relays; structure thickness; torsion actuators; van der Waals force; Abstracts; Fluctuations; Iron; Logic gates; Nanoelectromechanical systems; Silicon carbide; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
  • Conference_Location
    Wroclaw
  • Print_ISBN
    978-1-4673-6138-5
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2013.6529971
  • Filename
    6529971