DocumentCode
606916
Title
A multiscale model derivation and simulation tool for MEMS arrays
Author
yang, Bo ; Belkhir, W. ; Lenczner, M. ; Ratier, N.
Author_Institution
Dept. Temps-Frequence, Univ. of Franche-Comte, Besancon, France
fYear
2013
fDate
14-17 April 2013
Firstpage
1
Lastpage
8
Abstract
We introduce a framework for computer-aided derivation of multi-scale models dedicated to arrays of microsystems. It relies on a combination of a asymptotic methods used in the field of partial differential equations with term rewriting techniques coming from computer science. In our approach, a multi-scale model derivation is characterized by the features taken into account in the asymptotic analyses. Its formulation consists in a derivation of a reference model associated to an elementary nominal model, and in a set of transformations to apply to this proof until it takes into account the wanted features. In addition to the reference model proof, the framework includes first order rewriting principles designed for asymptotic model derivations, and second order rewriting principles dedicated to transformations of model derivations. We apply the method to generate a family of homogenized models for second order elliptic equations with periodic coefficients that could be posed in multi-dimensional domains, with possibly multi-domains and/or thin domains. The transfer of asymptotic models into a finite element software package is illustrated through an example of a model of periodic cantilever arrays.
Keywords
finite element analysis; microfabrication; partial differential equations; MEMS arrays; asymptotic methods; computer science; computer-aided derivation; elementary nominal model; finite element software package; homogenized models; multi-dimensional domains; multiscale model derivation; periodic cantilever arrays; reference model proof; second order rewriting principles; simulation tool; term rewriting techniques; Abstracts; Calculus; Gold; Homogenization; Multi-scale modeling; Rewriting; Symbolic computation;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location
Wroclaw
Print_ISBN
978-1-4673-6138-5
Type
conf
DOI
10.1109/EuroSimE.2013.6529977
Filename
6529977
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