DocumentCode :
606925
Title :
Modeling of mixed-mode delamination by cohesive zone method
Author :
Bingbing Zhang ; Daoguo Yang ; Ernst, L. ; Pape, H.
Author_Institution :
Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2013
fDate :
14-17 April 2013
Firstpage :
1
Lastpage :
7
Abstract :
Cohesive zone modeling of interface delamination requires proper values of the critical energy release rate of the interfaces being under investigation. In general, these values have been obtained thru dedicated delamination experiments. In cohesive zone modeling a complication to deal with is the fact that the critical energy release rate is not just a single value. Instead, it is a function of the socalled mode-mixity, a parameter depending from the ration between shear stress and tensile stress near the crack front. Most of the standard FEM packages include one or more types of cohesive zone elements, but generally, a mode-mix dependency cannot be specified. This might hinder a proper usage of cohesive zones in FEM modeling of microelectronic components. Therefore, the suitability of various FEM packages to deal with mixed mode delamination through cohesive zone modeling should be explored. The present paper describes such an exploration using the ANSYS package. Various mixed mode delamination experiments have been modeled using an available mixed mode cohesive zone model. The results are compared to the experimental results.
Keywords :
delamination; finite element analysis; shear strength; surface cracks; tensile strength; ANSYS package; FEM packages; cohesive zone modeling; crack front; critical energy release rate; microelectronic components; mixed-mode delamination; shear stress; tensile stress; Abstracts; Clamps; Electromagnetic compatibility; Load modeling; Materials; Thermal conductivity; Thermal loading;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4673-6138-5
Type :
conf
DOI :
10.1109/EuroSimE.2013.6529986
Filename :
6529986
Link To Document :
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