Title :
Measuring techniques for deformation and stress analysis in micro-dimensions
Author :
Vogel, D. ; Auerswald, E. ; Auersperg, J. ; Rzepka, S. ; Michel, Bruno
Author_Institution :
Fraunhofer ENAS, Chemnitz, Germany
Abstract :
The paper reviews some of the currently used strain / stress measurement tools developed for rather local application - deformation and stress measurement by Digital Image Correlation (DIC) techniques, microRaman, and electron diffraction for stress measurement. The selected methods possess spatial measurement resolutions of 1 μm or better, which makes them ideal to meet typical demands for strain and stress analyses on objects with high gradients, like e.g. advanced MEMS, semiconductor devices, and components of 3D IC integration. DIC methods applied to stress measurement, which have been seized past years by different labs, are described in more detail. Examples of stress determination on TSVs by DIC and microRaman approaches illustrate the utilization of these methods to analyze stresses in electronics components of current interest. Finally, a brief comparison between the DIC, microRaman and electron diffraction techniques (EBSD) is given.
Keywords :
electron diffraction; integrated circuit measurement; strain measurement; stress analysis; stress measurement; stress-strain relations; three-dimensional integrated circuits; 3D IC integration; DIC technique; EBSD; TSV; advanced MEMS; deformation; digital image correlation technique; electron diffraction technique; electronic components; measuring technique; microRaman approach; microdimensions; semiconductor devices; spatial measurement resolutions; strain-stress analysis; strain-stress measurement tools; stress analysis; stress determination; stress measurement; Abstracts; Analytical models; Displacement measurement; Fitting; Stress; Stress measurement; Thickness measurement;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Conference_Location :
Wroclaw
Print_ISBN :
978-1-4673-6138-5
DOI :
10.1109/EuroSimE.2013.6529991
