• DocumentCode
    606932
  • Title

    An integrated thermal management solution for flat-type solar photovoltaic modules

  • Author

    Rodgers, Peter ; Eveloy, Valerie

  • Author_Institution
    Dept. of Mech. Eng., Pet. Inst., Abu Dhabi, United Arab Emirates
  • fYear
    2013
  • fDate
    14-17 April 2013
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Solar photovoltaics (PV) are employed for a range of distributed power generation applications in the oil and gas industry. However, despite unprecedented solar irradiation levels in the Arabian Gulf, such installations incur significant power output losses in hot and dusty (i.e., desert) ambient conditions. In this study, a prototype PV module electrical performance enhancement solution is designed, constructed and experimentally characterized that combines active thermal management and sun-tracking to reduce PV cell operating temperature while enhancing solar irradiation absorption. Both steady-state and dynamic cooling conditions are investigated to compare the effectiveness of continuous and intermittent water-cooling. Water cooling a stationary PV module using unchilled water (35-40°C) is found to be at least as effective as sun-tracking a passively-cooled module in terms of power output. Chilled water-cooling (7-20°C) produces improvements in peak electrical power output of up to 40% depending on seasonal and daily conditions, relative to passively-cooled stationary operation. In addition, dynamic (i.e., intermittent) water-cooling is sufficient to maintain high PV module electrical output.
  • Keywords
    cooling; solar cells; thermal management (packaging); distributed power generation applications; dynamic cooling conditions; flat-type solar photovoltaic modules; integrated thermal management solution; intermittent water-cooling; prototype PV module electrical performance enhancement solution; sun-tracking; temperature 7 degC to 20 degC; Abstracts; Current measurement; Distance measurement; Europe;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
  • Conference_Location
    Wroclaw
  • Print_ISBN
    978-1-4673-6138-5
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2013.6529993
  • Filename
    6529993