DocumentCode :
60805
Title :
Reliability Concern on Extended E-SOA of SOI Power Devices With P-Sink Structures
Author :
Qinsong Qian ; Siyang Liu ; Weijun Wan ; Weifeng Sun
Author_Institution :
Nat. ASIC Syst. Eng. Res. Center, Southeast Univ., Nanjing, China
Volume :
13
Issue :
1
fYear :
2013
fDate :
Mar-13
Firstpage :
161
Lastpage :
166
Abstract :
The P-sink structure is widely used in silicon-on-insulator (SOI) power devices (SOI-LIGBT and SOI-LDMOS) to extend the electrical safe operating area (E-SOA) as it can suppress the trigger of the parasitic transistor. In this paper, the electrical behavior and reliability issues in the extended E-SOA for 200-V SOI power devices with P-sink structures are investigated for the first time. For SOI-LIGBT, the normal I-V curve and small hot-carrier-induced degradation are observed in the extended E-SOA; thereby, the P-sink structure plays a good role. However, for SOI-LDMOS, two mechanisms dominate the electrical behavior in the extended E-SOA so as to bring the unusual “hump” in the I- V curve; meanwhile, it results in serious hot-carrier-induced degradation, reducing the lifetime of the device in practical applications. As a result, the P-sink structure is not the best choice to extend the E-SOA of SOI-LDMOS.
Keywords :
insulated gate bipolar transistors; power MOSFET; semiconductor device reliability; silicon-on-insulator; P-sink structures; SOI power devices; SOI-LDMOS; SOI-LIGBT; Si; electrical safe operating area; extended E-SOA; hot-carrier-induced degradation; reliability; silicon-on-insulator; voltage 200 V; Current density; Degradation; Electric fields; Impact ionization; Logic gates; Reliability; Stress; Electrical safe operating area (E-SOA); SOI-LDMOS; SOI-LIGBT; hot-carrier-induced degradation;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2012.2226213
Filename :
6338281
Link To Document :
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