DocumentCode
608167
Title
Influence of barrier design on current collapse in high voltage AlGaN/GaN HEMTs
Author
Dasgupta, S. ; Biedermann, L. ; Sun, M. ; Kaplar, R.J. ; Marinella, Matthew J. ; Zavadil, K. ; Atcitty, S. ; Palacios, T.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2013
fDate
14-18 April 2013
Abstract
Simultaneous measurements of surface potential and drain current detrapping transients in AlGaN/GaN HEMTs, performed on devices with two different epitaxial structures, show that the predominant location of charge trapping is affected more strongly by device design than by surface passivation or buffer defects. Experiments also show that AlGaN traps dominate current collapse in devices with thick AlGaN barrier layers.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; power HEMT; wide band gap semiconductors; AlGaN-GaN; barrier design influence; barrier layers; buffer defects; current collapse; drain current detrapping transients; high voltage HEMT; surface passivation; surface potential; Aluminum gallium nitride; Charge carrier processes; Electric fields; Gallium nitride; Logic gates; Stress; Surface topography; Galium Nitride; Kelvin Force Microscopy; Power HEMT; Trapping;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4799-0112-8
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2013.6531986
Filename
6531986
Link To Document