• DocumentCode
    608167
  • Title

    Influence of barrier design on current collapse in high voltage AlGaN/GaN HEMTs

  • Author

    Dasgupta, S. ; Biedermann, L. ; Sun, M. ; Kaplar, R.J. ; Marinella, Matthew J. ; Zavadil, K. ; Atcitty, S. ; Palacios, T.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Abstract
    Simultaneous measurements of surface potential and drain current detrapping transients in AlGaN/GaN HEMTs, performed on devices with two different epitaxial structures, show that the predominant location of charge trapping is affected more strongly by device design than by surface passivation or buffer defects. Experiments also show that AlGaN traps dominate current collapse in devices with thick AlGaN barrier layers.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; power HEMT; wide band gap semiconductors; AlGaN-GaN; barrier design influence; barrier layers; buffer defects; current collapse; drain current detrapping transients; high voltage HEMT; surface passivation; surface potential; Aluminum gallium nitride; Charge carrier processes; Electric fields; Gallium nitride; Logic gates; Stress; Surface topography; Galium Nitride; Kelvin Force Microscopy; Power HEMT; Trapping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4799-0112-8
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2013.6531986
  • Filename
    6531986