• DocumentCode
    608169
  • Title

    Influence of device self-heating on trap activation energy extraction

  • Author

    Soci, F. ; Chini, Alessandro ; Meneghesso, Gaudenzio ; Meneghini, Matteo ; Zanoni, Enrico

  • Author_Institution
    Dept. of Eng. “Enzo Ferrari”, Univ. of Modena & Reggio Emilia, Modena, Italy
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Abstract
    In this paper results obtained by drain current transients measurement on GaN-based high electron mobility transistors (HEMTs) are presented. It will be shown that neglecting device self-heating effects during the calculation process can lead to an underestimation of said energies and to non-overlapping Arrhenius plots, when the emission time constants are extracted at different device dissipated power levels. Thanks to the estimation of the mean channel thermal resistance, thermal effects were taken into account by correcting the measured data. Higher activation energy values have then been extracted and a reasonable overlap of the Arrhenius plots was obtained amongst measurements carried out at different dissipated powers. The experimental results are also suggesting a novel method for the extraction of device thermal resistance, which yielded similar results with respect to other experimental techniques.
  • Keywords
    III-V semiconductors; electric current measurement; gallium compounds; high electron mobility transistors; thermal resistance; wide band gap semiconductors; Arrhenius plots; GaN; HEMT; calculation process; device dissipated power levels; device self-heating effects; drain current transients measurement; emission time constants; high electron mobility transistors; mean channel thermal resistance; thermal effects; trap activation energy extraction; Current measurement; Electrical resistance measurement; HEMTs; Temperature measurement; Thermal resistance; Transient analysis; MODFET; carrier trapping; ionization energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4799-0112-8
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2013.6531988
  • Filename
    6531988