• DocumentCode
    608185
  • Title

    Aging sensors for workload centric guardbanding in dynamic voltage scaling applications

  • Author

    Min Chen ; Kufluoglu, H. ; Carulli, J. ; Reddy, Veerababu

  • Author_Institution
    Texas Instrum., Dallas, TX, USA
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Abstract
    BTI induced aging degradation threatens circuit reliability through circuit performance degradation. This degradation is strongly workload dependent and can result in unbalanced signal edge degradation as asymmetric aging. Three ring oscillator based asymmetric aging sensitive sensors are demonstrated in a 28nm low power/poly SiON CMOS technology. These sensors are shown to be capable of providing an adequate circuit guard band to account for signal edge degradation due to NBTI. A novel DVS workload centric monitor embedded with asymmetric aging sensitive sensors is proposed for aging and power trade-off assessment. The measured data indicates that signal edge degradation has a linear dependency on workload ratio. The impact of the dynamic voltage scaling workload profile on aging and power is experimentally studied with this aging monitor and allows the assessment assists to the modeling of aging margin relaxation.
  • Keywords
    CMOS integrated circuits; ageing; integrated circuit reliability; negative bias temperature instability; sensors; DVS workload centric monitor; NBTI induced aging degradation; aging margin relaxation modeling; asymmetric aging sensitive sensors; circuit performance degradation; circuit reliability; dynamic voltage scaling applications; dynamic voltage scaling workload profile; linear dependency; low power-polyCMOS technology; power trade-off assessment; size 28 nm; unbalanced signal edge degradation; workload centric guardbanding; Aging; Degradation; Logic gates; Monitoring; Sensors; Stress; Voltage control; BTI; RO; asymetric aging; circuit relibility; dynamic voltage scaling; guard band; power; sensor; workload;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4799-0112-8
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2013.6532004
  • Filename
    6532004