• DocumentCode
    608212
  • Title

    Delamination in BEOL: Analysis of interface failure by combined experimental & modeling approaches

  • Author

    Debecker, B. ; Vanstreels, K. ; Gonzalez, M. ; Vandevelde, B.

  • Author_Institution
    imec, Leuven, Belgium
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Abstract
    It is demonstrated that the widely used equation to derive the adhesive strength from the external load in a 4 point bending test has a certain error by taking only the substrate´s elastic parameters into account. Next to this, failure location analysis gives insight on the measured variation of adhesive strength for the same interface. Subsequently, with numerical simulations, the adhesive strength can be separated in its different energy modes, allowing a better understanding and characterization of the experimental observations (e.g. higher cohesive energy for increasing low-k stiffness). Finally, the competing failure mechanisms within the BEOL are identified as necessary qualifiers for BEOL failure assessment, where currently adhesion strength is mainly used for ranking the performance of different BEOL interfaces.
  • Keywords
    delamination; failure analysis; finite element analysis; low-k dielectric thin films; materials testing; mechanical strength; 4-point bending test; BEOL failure assessment; BEOL interfaces; adhesive strength; back-end-of-line; delamination; energy modes; failure location analysis; failure mechanisms; finite element modelling; interface failure analysis; low-k stiffness; mechanical strength characterization; numerical simulations; Adhesive strength; Adhesives; Delamination; Load modeling; Stress; Substrates; Adhesion; Back-end-of-line; Delamination; Finite Element Modeling; Mode Separation; VCCT;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4799-0112-8
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2013.6532031
  • Filename
    6532031