DocumentCode
608212
Title
Delamination in BEOL: Analysis of interface failure by combined experimental & modeling approaches
Author
Debecker, B. ; Vanstreels, K. ; Gonzalez, M. ; Vandevelde, B.
Author_Institution
imec, Leuven, Belgium
fYear
2013
fDate
14-18 April 2013
Abstract
It is demonstrated that the widely used equation to derive the adhesive strength from the external load in a 4 point bending test has a certain error by taking only the substrate´s elastic parameters into account. Next to this, failure location analysis gives insight on the measured variation of adhesive strength for the same interface. Subsequently, with numerical simulations, the adhesive strength can be separated in its different energy modes, allowing a better understanding and characterization of the experimental observations (e.g. higher cohesive energy for increasing low-k stiffness). Finally, the competing failure mechanisms within the BEOL are identified as necessary qualifiers for BEOL failure assessment, where currently adhesion strength is mainly used for ranking the performance of different BEOL interfaces.
Keywords
delamination; failure analysis; finite element analysis; low-k dielectric thin films; materials testing; mechanical strength; 4-point bending test; BEOL failure assessment; BEOL interfaces; adhesive strength; back-end-of-line; delamination; energy modes; failure location analysis; failure mechanisms; finite element modelling; interface failure analysis; low-k stiffness; mechanical strength characterization; numerical simulations; Adhesive strength; Adhesives; Delamination; Load modeling; Stress; Substrates; Adhesion; Back-end-of-line; Delamination; Finite Element Modeling; Mode Separation; VCCT;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4799-0112-8
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2013.6532031
Filename
6532031
Link To Document