DocumentCode :
608212
Title :
Delamination in BEOL: Analysis of interface failure by combined experimental & modeling approaches
Author :
Debecker, B. ; Vanstreels, K. ; Gonzalez, M. ; Vandevelde, B.
Author_Institution :
imec, Leuven, Belgium
fYear :
2013
fDate :
14-18 April 2013
Abstract :
It is demonstrated that the widely used equation to derive the adhesive strength from the external load in a 4 point bending test has a certain error by taking only the substrate´s elastic parameters into account. Next to this, failure location analysis gives insight on the measured variation of adhesive strength for the same interface. Subsequently, with numerical simulations, the adhesive strength can be separated in its different energy modes, allowing a better understanding and characterization of the experimental observations (e.g. higher cohesive energy for increasing low-k stiffness). Finally, the competing failure mechanisms within the BEOL are identified as necessary qualifiers for BEOL failure assessment, where currently adhesion strength is mainly used for ranking the performance of different BEOL interfaces.
Keywords :
delamination; failure analysis; finite element analysis; low-k dielectric thin films; materials testing; mechanical strength; 4-point bending test; BEOL failure assessment; BEOL interfaces; adhesive strength; back-end-of-line; delamination; energy modes; failure location analysis; failure mechanisms; finite element modelling; interface failure analysis; low-k stiffness; mechanical strength characterization; numerical simulations; Adhesive strength; Adhesives; Delamination; Load modeling; Stress; Substrates; Adhesion; Back-end-of-line; Delamination; Finite Element Modeling; Mode Separation; VCCT;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4799-0112-8
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2013.6532031
Filename :
6532031
Link To Document :
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