DocumentCode :
608225
Title :
Reliable micro-electro-mechanical (MEM) switch design for ultra-low-power logic
Author :
Hei Kam ; Yenhao Chen ; Tsu-Jae King Liu
Author_Institution :
Intel Corp., Hillsboro, OR, USA
fYear :
2013
fDate :
14-18 April 2013
Abstract :
Fundamental energy-efficiency limits for transistor-based digital logic circuits have led to renewed interest in micro-electro-mechanical (MEM) switches [1-12] because they have the ideal characteristics of zero off-state leakage and abrupt switching behavior. Reliable operation with high endurance is a key requirement for digital logic applications, and historically has been a challenge for mechanical computing devices. This paper discusses various failure modes for MEM switches, with particular focus on contact stiction due to welding. Experimental results show that device endurance (number of on/off switching cycles before welding-induced failure) improves exponentially with decreasing contact temperature, and that it depends on the contact material, contact voltage (VC), on-state resistance (RON) and load capacitance. A contact reliability model calibrated to the experimental data projects that endurance will exceed 1015 cycles at 1V operating voltage. Implications for switch contact design, logic applications and dimension scaling are discussed.
Keywords :
failure analysis; logic circuits; low-power electronics; microswitches; reliability; transistor circuits; MEM switch design; contact material; contact reliability model; contact temperature; contact voltage; dimension scaling; failure modes; fundamental energy-efficiency; load capacitance; mechanical computing devices; on-state resistance; reliable microelectromechanical switch design; switching behavior; transistor-based digital logic circuits; ultra-low-power logic; voltage 1 V; zero off-state leakage characteristics; CMOS integrated circuits; Contacts; Dielectrics; Relays; Reliability; Switches; Switching circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2013 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4799-0112-8
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2013.6532044
Filename :
6532044
Link To Document :
بازگشت