• DocumentCode
    608228
  • Title

    Wafer-level MEMS package and its reliability issues

  • Author

    Tanaka, Shoji ; Esashi, Masayoshi

  • Author_Institution
    Tohoku Univ., Sendai, Japan
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Abstract
    This paper reviews wafer-level hermetic packaging technology using anodic bonding from several reliability points of view. First, reliability risk factors of high temperature, high voltage and electrochemical O2 generation during anodic bonding are discussed. Next, electrical interconnections through a hermetic package, i.e. electrical feedthrough, is discussed. The reliability of both hermetic sealing and electrical feedthrough must be simultaneously satisfied. A new wafer-level MEMS packaging material, anodically-bondable low temperature cofired ceramic (LTCC) wafer, is introduced, and its reliability data on hermetic sealing, electrical interconnection and flip-chip mounting on a printed circuit board (PCB) are described.
  • Keywords
    anodisation; ceramic packaging; electrochemical analysis; flip-chip devices; hermetic seals; integrated circuit interconnections; integrated circuit reliability; micromechanical devices; printed circuit interconnections; wafer bonding; wafer level packaging; LTCC; PCB; anodically-bondable low temperature cofired ceramic wafer; electrical feedthrough; electrical interconnection; electrochemical generation; flip-chip mounting; hermetic sealing; printed circuit board; reliability risk factor; wafer-level MEMS packaging material; wafer-level hermetic packaging technology; Bonding; Cavity resonators; Glass; Micromechanical devices; Packaging; Semiconductor device reliability; Anodic bonding; Electrical feedthrough; Low temperature cofired ceramics (LTCC); Micro electro mechanical systems (MEMS); Wafer-level packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4799-0112-8
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2013.6532047
  • Filename
    6532047