• DocumentCode
    608265
  • Title

    Failure recovery mechanism caused by secondary defect

  • Author

    Karki, Suman ; Nguyen, Donald

  • Author_Institution
    DDAO, Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Abstract
    This paper addresses how an observed secondary defect could be induced during the failure analysis and caused the original failure mode to be recovered. Two cases studies will be presented with the systematic approach of Failure analysis and successful attempt of finding the original failure defect while extrapolating the data at the time of failure recovery. Understanding the working of the circuitry in question is necessary to trace the original failure.
  • Keywords
    extrapolation; failure analysis; integrated circuit reliability; circuitry; data extrapolation; failure analysis; failure recovery mechanism; secondary defect; Capacitors; Circuit faults; Contacts; Failure analysis; Resistors; Scanning electron microscopy; Circuitry Analysis; Current Leakage; Current Mirrors; FIB Probe Pads; Fault Isolation; IC Failure Analysis; Micro-Probing; Mixed Signals; Nodal Probing; Original defect; Secondary defect; VREF circuitry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4799-0112-8
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2013.6532084
  • Filename
    6532084