Title :
Cost evaluation of the integration of IP/MPLS and WDM elements
Author :
Duque, R. ; Lopez, Victor ; Gonzalez, Adriana ; de Dios, O.G. ; Fernandez-Palacios, Juan Pedro
Author_Institution :
Telefonica I+D, Madrid, Spain
Abstract :
Multi-layer integration is an important trend in the telecom industry as a cost-efficient alternative. From an incremental CapEx analysis, we aim to quantify the maximum cost savings that could be achieved by such integration.
Keywords :
IP networks; costing; multiprotocol label switching; telecommunication industry; wavelength division multiplexing; CapEx analysis; IP/MPLS integration; WDM elements; cost evaluation; cost-efficient alternative; maximum cost savings; multilayer integration; telecom industry; IP networks; Investment; Multiprotocol label switching; Optical switches; Photonics; Transponders; Wavelength division multiplexing;
Conference_Titel :
Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4799-0457-0
