Title :
High density optical interconnects integrated with lasers, optical modulators and photodetectors on a single silicon chip
Author :
Urino, Yutaka ; Horikawa, Tsuyoshi ; Nakamura, T. ; Arakawa, Yasuhiko
Author_Institution :
Inst. for Photonics-Electron. Convergence Syst. Technol. (PECST), Japan
Abstract :
Silicon optical interposers for inter-chip interconnects, integrated with lasers, an optical splitter, optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm2 transmission density were achieved.
Keywords :
optical interconnections; optical modulation; photodetectors; error free data transmission; germanium photodetectors; high density optical interconnects; interchip interconnects; lasers; optical modulators; optical splitter; silicon chip; silicon optical interposer; single silicon substrate; transmission density; Adaptive optics; Optical device fabrication; Optical interconnections; Optical modulation; Optical polarization; Optical waveguides; Silicon;
Conference_Titel :
Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4799-0457-0
