• DocumentCode
    608922
  • Title

    A high end routing platform for core and edge applications based on chip to chip optical interconnect

  • Author

    Hasharoni, K. ; Benjamin, S. ; Geron, A. ; Katz, Gil ; Stepanov, S. ; Margalit, N. ; Mesh, M.

  • Author_Institution
    Compass Electro-Opt. Syst., Netanya, Israel
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A telecom router utilizing a parallel optical interconnect is described with the highest reported aggregate bandwidth 1.34Tb/s, and density 64Gb/s/mm2. The device is based on direct assembly of large optoelectronic III-V chips on CMOS.
  • Keywords
    CMOS integrated circuits; III-V semiconductors; integrated optoelectronics; optical interconnections; telecommunication network routing; CMOS; aggregate bandwidth; bit rate 1.34 Tbit/s; chip to chip optical interconnect; core application; density; direct assembly; edge application; high end routing platform; optoelectronic III-V chips; parallel optical interconnect; telecom router; Bandwidth; Optical fiber devices; Optical fiber dispersion; Optical fibers; Optical interconnections; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013
  • Conference_Location
    Anaheim, CA
  • Print_ISBN
    978-1-4799-0457-0
  • Type

    conf

  • Filename
    6533062
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=608922