Title :
A high end routing platform for core and edge applications based on chip to chip optical interconnect
Author :
Hasharoni, K. ; Benjamin, S. ; Geron, A. ; Katz, Gil ; Stepanov, S. ; Margalit, N. ; Mesh, M.
Author_Institution :
Compass Electro-Opt. Syst., Netanya, Israel
Abstract :
A telecom router utilizing a parallel optical interconnect is described with the highest reported aggregate bandwidth 1.34Tb/s, and density 64Gb/s/mm2. The device is based on direct assembly of large optoelectronic III-V chips on CMOS.
Keywords :
CMOS integrated circuits; III-V semiconductors; integrated optoelectronics; optical interconnections; telecommunication network routing; CMOS; aggregate bandwidth; bit rate 1.34 Tbit/s; chip to chip optical interconnect; core application; density; direct assembly; edge application; high end routing platform; optoelectronic III-V chips; parallel optical interconnect; telecom router; Bandwidth; Optical fiber devices; Optical fiber dispersion; Optical fibers; Optical interconnections; Vertical cavity surface emitting lasers;
Conference_Titel :
Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4799-0457-0
