Low temperature indium-based sealing of microfabricated alkali cells for chip scale atomic clocks

In this paper, the development of a low temperature bonding process focused on indium-based technology for microfabricated alkali cells is presented. The intended application is the use of these cells in chip scale atomic clocks. The existing technology is mainly based on anodic bonding. For some applications, such as where wall coating is used instead of buffer gas, anodic bonding cannot be applied because of the relatively high temperature of the process.