Thinned dies in a stretchable package

Conformable, stretchable electronic circuits relying on conventional high-performance electronic materials have been realized. Thinned dies (∼ 30 μm thickness) are embedded in a slim polyimide package (50 μm–60 μm thickness), electrically connected using polyimide-supported thin-film meandering gold conductors and subsequently embedded in polydimethylsiloxane (PDMS). The technology is demonstrated by embedding a commercially available microcontroller, i.e. a MSP430F1611 (Texas Instruments), thinned down to ∼ 30 μm thickness.