A novel injection molded fluidic interposer for microfluidic applications

The implementation of fluidic functions in 3D-MID (three dimensional molded interconnect devices) allows to create a new field of applications and enhanced system solutions. We report about the capabilities of MID for the packaging of chip modules with microfluidic functions. A mechanically stable and leak tight fluidic connection is needed between the microfluidic chip and the environment. For this purpose a fluidic interposer is fabricated by the LDS-process (laser direct structuring) and includes a metallization for electrical signals and channel structures for fluidic features. The presented interposer enables the transformation of fluidic ports from the macro- to the micro scale. To characterize the device, a microfluidic test chip made of silicon and glass (Borofloat^®) has been fabricated and mounted on the fluidic interposer by a flip-chip vapor phase process. Finally the potential of the system is shown by testing maximum pressurization and fluidic sealing.