Micro-fabrication as enabler for sub-μm photonic alignment

In the manufacturing of photonic packages, the alignment of the components must often meet strict precision demands. For several applications, sub-micrometre alignment must be achieved, and this precision needs to be maintained once the components are aligned. In our research we explore the use of micro-fabrication technology as the enabler for reaching sub-μm alignment precision. Two main concepts are presented: the use of micro-actuators for active alignment and the use of mating structures for passive alignment. Results from MEMS-based active fibre alignment and multi-port passive chip-to-chip alignment are described. Finally, the paper discusses the limits and applicability of the two concepts.