Title :
Plasma dicing technology
Author :
Matsubara, Noriyuki ; Windemuth, Reinhard ; Mitsuru, Hiroshima ; Atsushi, Harikai
Author_Institution :
Panasonic Factory Solutions Europe, A division of Panasonic Industries Devices Sales Europe GmbH, Winsbergring 15, D-22525 Hamburg, Germany
Abstract :
Conventional methods for wafer dicing like mechanical or laser dicing solution are showing some limitations. Plasma dicing process was designed to overcome such limitations regarding chip damage and throughput which is discussed in comparison with conventional dicing methods. Typical overall process flow is explained in detail. Some examples of etching results are shown. Solutions for round-corner-etching are explained. We will give better understanding of future solutions for dicing process by use of plasma.
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location :
Amsterdam, Netherlands
Print_ISBN :
978-1-4673-4645-0
DOI :
10.1109/ESTC.2012.6542178
