Embedded components in photovia substrates

This paper deals with the research and development of high density interconnection (HDI) substrates and passive components embedded into HDI substrates. Both HDI substrates and passive embedded components are fully formed by the photolithography method. The manufacturing process consists of screen printing process used for individual layers deposition and photolithography process for all layers structuring. The photosensitive dielectric material, used in these HDI substrates, was specially designed for this application and consists of photoimageable photopolymer and ceramic filler. The manufacturing process of HDI substrates with embedded components was specified and verified. Impedance to frequency characteristic, capacity to temperature and capacity to voltage characteristic of embedded capacitors were measured in detail. Impedance to frequency characteristics were also measured for embedded inductors. Electrical parameters of embedded components were calculated as well.