DocumentCode :
609832
Title :
Analysis of thermo-mechanical stresses in novel back contact solar modules
Author :
Wiese, Stefan ; Kraemer, F.
Author_Institution :
Saarland University, Chair of Microintegration and Reliability, Campus A5 1, D-66123 Saarbruecken, Germany
fYear :
2012
fDate :
17-20 Sept. 2012
Firstpage :
1
Lastpage :
6
Abstract :
The mechanical integrity of interconnect structures in photovoltaic modules is a crucial factor for the lifetime of a PV power plant. Therefore the mechanical stresses in different types of PV module assemblies were analyzed by FEM-simulations. The goal is to develop a systematic understanding of mechanical behavior of photovoltaic modules. The study figures out the critical elements in the module interconnect structures which are most likely to fail.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location :
Amsterdam, Netherlands
Print_ISBN :
978-1-4673-4645-0
Type :
conf
DOI :
10.1109/ESTC.2012.6542206
Filename :
6542206
Link To Document :
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