DocumentCode :
61026
Title :
on-Resistance Degradation Induced by Hot-Carrier Injection in SOI SJ-LDMOS
Author :
Chao Xia ; Xinhong Cheng ; Zhongjian Wang ; Duo Cao ; Tingting Jia ; Yuehui Yu ; Dashen Shen
Author_Institution :
State Key Lab. of Functional Mater. for Inf., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
Volume :
60
Issue :
3
fYear :
2013
fDate :
Mar-13
Firstpage :
1279
Lastpage :
1281
Abstract :
In this brief, anomalous hot-carrier degradation phenomenon in n-type superjunction lateral DMOS transistors on a SOI substrate is investigated. An unexpected on-resistance (Ron) decrease was observed at the beginning of stress, but Ron increases with the stress time. The reason was analyzed with the 3-D simulation of electrical field and impact ionization generation. The injection of hot holes into the field oxide near the drain region leads to the Ron decrease during the early stress period. With the increase of stress time, trapped hot holes accumulated in the field oxide and act as electron defects to trap electrons, altogether with hot electrons trapped in gate oxide above the accumulation region, contributing to Ron increase.
Keywords :
MOSFET; hot carriers; impact ionisation; silicon-on-insulator; 3D simulation; SOI SJ-LDMOS; SOI substrate; Si; accumulation region; anomalous hot-carrier degradation phenomenon; electrical field; electron defects; field oxide; hot electrons; hot hole injection; hot-carrier injection; impact ionization generation; n-type superjunction lateral DMOS transistors; on-resistance degradation; stress time; trapped hot holes; unexpected on-resistance decrease; Degradation; Electron traps; Hot carrier injection; Logic gates; Stress; Hot carrier; SOI; lateral DMOS (LDMOS); reliability; superjunction (SJ) LDMOS (SJ-LDMOS);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2242077
Filename :
6464554
Link To Document :
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