• DocumentCode
    610279
  • Title

    Invited tutorial: Channel equalization: Techniques for high-speed electrical links

  • Author

    Palermo, Samuel

  • Author_Institution
    Texas A&M Univ., College Station, TX, USA
  • fYear
    2013
  • fDate
    12-12 April 2013
  • Abstract
    Summary form only given. While high-performance I/O circuitry can leverage the technology improvements that enable increased on-chip performance, unfortunately the bandwidth of the electrical channels used for inter-chip communication has not scaled in the same manner. This tutorial provides an overview of channel equalization techniques used in multi-Gb/s transceivers to overcome bandwidth limitations present in electrical chip-to-chip communication. The first part of the tutorial will cover the dominant sources of electrical interconnect channel losses, such as skin effect, dielectric loss, and reflections due to impedance discontinuities. Next, trade-offs and circuit implementations of common equalizer circuits, including finite-impulse-response (FIR) filters, continuous-time linear equalizers (CTLE), and decision-feedback equalizers (DFE), are detailed. The performance impact of these different equalizer topologies over real-world channels is illustrated using a statistical link analysis tool and through a comparison of several recent high-performance I/O transceiver implementations. Finally, the tutorial concludes with a discussion on different equalizer adaptation techniques.
  • Keywords
    FIR filters; decision feedback equalisers; network topology; radio transceivers; telecommunication channels; CTLE; DFE; FIR filter; bandwidth limitation; channel equalization; continuous-time linear equalizer; decision-feedback equalizer; dielectric loss; electrical channel bandwidth; electrical chip-to-chip communication; electrical interconnect channel loss; equalizer adaptation; equalizer circuit; equalizer topology; finite-impulse-response filter; high-performance I/O circuitry; high-performance I/O transceiver; high-speed electrical link; impedance discontinuities; interchip communication; on-chip performance; real-world channel; reflection; skin effect; statistical link analysis tool; technology improvement; Abstracts; Dielectric losses; Educational institutions; Equalizers; Optical losses; Tutorials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electron Devices (WMED), 2013 IEEE Workshop on
  • Conference_Location
    Boise, ID
  • ISSN
    1947-3834
  • Print_ISBN
    978-1-4673-6034-0
  • Type

    conf

  • DOI
    10.1109/WMED.2013.6544497
  • Filename
    6544497