• DocumentCode
    610282
  • Title

    Invited talk: Computing beyond the 11nm node: Which devices will we use?

  • Author

    Haensch, Wilfried

  • Author_Institution
    T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
  • fYear
    2013
  • fDate
    12-12 April 2013
  • Abstract
    Summary form only given. The enormous success of Si CMOS technology is based on the economy of scale. Cost is driven down by increasing wafer size and decreasing feature sizes while performance is steadily growing. The pervasive nature of microelectronic can be seen in all aspects of daily life. The industry enjoyed the success story for several decades by simply following the scaling laws. More recently it is realized that increased performance will come at an unacceptable cost of power and conventional CMOS scaling is rapidly coming to an end. The quest for solutions is in full swing how to meet the computational demands for the foreseeable future. Possible solutions are the change of device architecture and the introduction of high mobility materials for the devices to boost performance. Beyond the classical device materials Si, Ge, and some III/V compounds carbon in the form of carbon nano tubes or graphene are suggested as possible alternative candidates for digital applications. Replacing the field effect transistor by a tunnel FET holds the promise of a low power switch that can be realized with conventional channel materials. Moving from electrical charge to other state variables, like for instance spin, might provide new possibilities to meet the computational needs in the future.
  • Keywords
    CMOS integrated circuits; III-V semiconductors; economies of scale; field effect transistors; germanium; low-power electronics; silicon; tunnelling; CMOS technology; Ge; Si; boost performance; channel materials; classical device materials; conventional CMOS scaling; economy of scale; electrical charge; field effect transistor; low power switch; mobility materials; pervasive nature; scaling laws; size 11 nm; tunnel FET; wafer size; Abstracts; Microelectronics; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electron Devices (WMED), 2013 IEEE Workshop on
  • Conference_Location
    Boise, ID
  • ISSN
    1947-3834
  • Print_ISBN
    978-1-4673-6034-0
  • Type

    conf

  • DOI
    10.1109/WMED.2013.6544500
  • Filename
    6544500