Title :
Wideband Millimeter-Wave Substrate Integrated Waveguide Cavity-Backed Rectangular Patch Antenna
Author :
Tian Yang Yang ; Wei Hong ; Yan Zhang
Author_Institution :
State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
Abstract :
In this letter, a new type of wideband substrate integrated waveguide (SIW) cavity-backed patch antenna and array for millimeter wave (mmW) are investigated and implemented. The proposed antenna is composed of a rectangular patch with a backed SIW cavity. In order to enhance the bandwidth and radiation efficiency, the cavity is designed to resonate at its TE210 mode. Based on the proposed antenna, a 4 × 4 array is also designed. Both the proposed antenna and array are fabricated with standard printed circuit board (PCB) process, which possess the advantage of easy integration with planar circuits. The measured bandwidth (|S11| ≤ -10 dB) of the antenna element is larger than 15%, and that of the antenna array is about 8.7%. The measured peak gains are 6.5 dBi for the element and 17.8 dBi for the array, and the corresponding simulated radiation efficiencies are 83.9% and 74.9%, respectively. The proposed antenna and array are promising for millimeter-wave applications due to its merits of wide band, high efficiency, low cost, low profile, etc.
Keywords :
antenna radiation patterns; broadband antennas; microstrip antenna arrays; millimetre wave antenna arrays; printed circuits; substrate integrated waveguides; antenna element; bandwidth enhancement; efficiency 74.9 percent; efficiency 83.9 percent; millimeter-wave antenna array; planar circuits; radiation efficiency enhancement; standard PCB process; standard printed circuit board process; substrate integrated waveguide antenna; wideband SIW cavity-backed rectangular patch antenna; Antenna arrays; Antenna measurements; Antenna radiation patterns; Arrays; Cavity resonators; Microstrip antennas; Patch antennas; Antenna; array; high efficiency; millimeter-wave; substrate integrated waveguide (SIW); wideband;
Journal_Title :
Antennas and Wireless Propagation Letters, IEEE
DOI :
10.1109/LAWP.2014.2300194