Flip-chip package with integrated antenna on a polyimide substrate for a 122-GHz bistatic radar IC

Author

Beer, Sebastian ; Girma, Mekdes Gebresilassie ; Yaoming, S. ; Winkler, Wolfgang ; Debski, W. ; Paaso, J. ; Kunkel, G. ; Scheytt, J. Christoph ; Hasch, Juergen ; Zwick, T.

Author_Institution

Karlsruhe Inst. of Technol., Karlsruhe, Germany

fYear

2013

fDate

8-12 April 2013

Firstpage

121

Lastpage

125

Abstract

This paper presents the packaging technology and the integrated antenna design for a miniaturized 122-GHz radar sensor. The package layout and the assembly process are shortly explained. Measurements of the antenna including the flip chip interconnect are presented that have been achieved by replacing the IC with a dummy chip that only contains a through-line. Afterwards, radiation pattern measurements are shown that were recorded using the radar sensor as transmitter. Finally, details of the fully integrated radar sensor are given, together with results of the first Doppler measurements.

Keywords

antenna radiation patterns; assembling; flip-chip devices; integrated circuit interconnections; millimetre wave detectors; millimetre wave integrated circuits; millimetre wave radar; polymers; Doppler measurements; assembly process; bistatic radar IC; dummy chip; flip chip interconnect; flip-chip package; frequency 122 GHz; fully integrated radar sensor; integrated antenna design; miniaturized radar sensor; package layout; polyimide substrate; radiation pattern measurements; transmitter; Antenna measurements; Antenna radiation patterns; Integrated circuits; Radar; Radar antennas; Antennas; Millimeter wave integrated circuits; Packaging; Radar; Radio frequency integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (EuCAP), 2013 7th European Conference on

Conference_Location

Gothenburg

Print_ISBN

978-1-4673-2187-7

Electronic_ISBN

978-88-907018-1-8

Type

conf

Filename

6546229