Title :
D-band grid-array antenna integrated in the lid of a surface-mountable chip-package
Author :
Beer, Sebastian ; Rusch, Christian ; Gottel, B. ; Gulan, Heiko ; Zwick, T.
Author_Institution :
Inst. fuer Hochfrequenztech. und Elektron. (IHE), Karlsruhe, Germany
Abstract :
A packaging solution for single-chip millimeter-wave transceivers is presented. It integrates an antenna into the lid of the chip package. Multi-layer organic materials are used as antenna substrate. A prototype demonstrates the feasibility of the packaging process and the antenna performance. It consists of three parts: A package base; a MMIC dummy that allows measuring the antenna including the flip chip interconnect; and a 122-GHz grid array antenna. The complete antenna-in-package prototype is measured using a probe based measurement system.
Keywords :
MMIC; flip-chip devices; millimetre wave antennas; radio transceivers; D-band grid-array antenna; MMIC dummy; antenna substrate; antenna-in-package prototype; flip chip interconnect; frequency 122 GHz; multilayer organic materials; package base; packaging solution; probe-based measurement system; single-chip millimeter-wave transceivers; surface-mountable chip-package lid; Antenna measurements; Antennas; MMICs; Packaging; Prototypes; Substrates;
Conference_Titel :
Antennas and Propagation (EuCAP), 2013 7th European Conference on
Conference_Location :
Gothenburg
Print_ISBN :
978-1-4673-2187-7
Electronic_ISBN :
978-88-907018-1-8
