A 60 GHz CMOS-SOI integrated antenna with coupled patch in a QFN package

Author

Zevallos Luna, Jose A. ; Dussopt, Laurent ; Siligaris, Alexandre

Author_Institution

LETI, CEA, Grenoble, France

fYear

2013

fDate

8-12 April 2013

Firstpage

2632

Lastpage

2635

Abstract

A 60-GHz folded dipole antenna integrated with a transceiver on a 65-nm CMOS-SOI chip for short range and low power wireless communications is presented. The chip is packaged in a QFN48L pre-molded cavity package with removable lid. Radiating patch elements coupled to the on-chip folded dipole are fabricated under the package lid to improve the radiation performances. The experimental radiation patterns and gain values show an excellent agreement with the simulations. An antenna gain up to 3-5.7 dBi at 60 GHz is demonstrated with good impedance matching over a 13% bandwidth.

Keywords

CMOS integrated circuits; antenna radiation patterns; microstrip antennas; radio networks; CMOS-SOI integrated antenna; QFN48L premolded cavity package; antenna gain; coupled patch; folded dipole antenna; frequency 60 GHz; gain 3 dB to 5.7 dB; low power wireless communications; onchip folded dipole; radiating patch elements; radiation performances; short range wireless communications; size 65 nm; Antenna measurements; Antenna radiation patterns; Dipole antennas; Gain; Transceivers; 60 GHz; Millimeter-wave antennas; integrated antennas; packaging; system-in-package; system-on-chip;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (EuCAP), 2013 7th European Conference on

Conference_Location

Gothenburg

Print_ISBN

978-1-4673-2187-7

Electronic_ISBN

978-88-907018-1-8

Type

conf

Filename

6546774