DocumentCode
612250
Title
Message from the Advisory Committee Chair
Author
Nakamura, T.
fYear
2013
fDate
17-19 April 2013
Abstract
The goal of this conference is, as always, to be part of the premier conference series on microprocessor architecture and technology. This rapidly growing field regularly and aggressively produces innovative ideas and products that enable a transformation of the world around us day by day. Starting as an IEICE conference in 1998, today the COOL Chips conference series has become an internationally well-known conference series sponsored by the IEEE Computer Society in cooperation with IEICE Electron Device Society and IPSJ. COOL Chips is a sister conference to the HOT Chips held at Stanford University and HOT Interconnect conference held in California each August. We also invite you to attend these conference series. The relation between the COOL and HOT chips conferences is important as it spans geography and seasons.
fLanguage
English
Publisher
ieee
Conference_Titel
Cool Chips XVI (COOL Chips), 2013 IEEE
Conference_Location
Yokohama, Japan
Print_ISBN
978-1-4673-5780-7
Electronic_ISBN
978-1-4673-5781-4
Type
conf
DOI
10.1109/CoolChips.2013.6547907
Filename
6547907
Link To Document