• DocumentCode
    612250
  • Title

    Message from the Advisory Committee Chair

  • Author

    Nakamura, T.

  • fYear
    2013
  • fDate
    17-19 April 2013
  • Abstract
    The goal of this conference is, as always, to be part of the premier conference series on microprocessor architecture and technology. This rapidly growing field regularly and aggressively produces innovative ideas and products that enable a transformation of the world around us day by day. Starting as an IEICE conference in 1998, today the COOL Chips conference series has become an internationally well-known conference series sponsored by the IEEE Computer Society in cooperation with IEICE Electron Device Society and IPSJ. COOL Chips is a sister conference to the HOT Chips held at Stanford University and HOT Interconnect conference held in California each August. We also invite you to attend these conference series. The relation between the COOL and HOT chips conferences is important as it spans geography and seasons.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Cool Chips XVI (COOL Chips), 2013 IEEE
  • Conference_Location
    Yokohama, Japan
  • Print_ISBN
    978-1-4673-5780-7
  • Electronic_ISBN
    978-1-4673-5781-4
  • Type

    conf

  • DOI
    10.1109/CoolChips.2013.6547907
  • Filename
    6547907