DocumentCode
612269
Title
Supporting organization
fYear
2013
fDate
17-19 April 2013
Abstract
The conference organizers greatly appreciate the support of the various corporate sponsors listed.
fLanguage
English
Publisher
ieee
Conference_Titel
Cool Chips XVI (COOL Chips), 2013 IEEE
Conference_Location
Yokohama, Japan
Print_ISBN
978-1-4673-5780-7
Electronic_ISBN
978-1-4673-5781-4
Type
conf
DOI
10.1109/CoolChips.2013.6547926
Filename
6547926
Link To Document