• DocumentCode
    612974
  • Title

    Experiments and analysis to characterize logic state retention limitations in 28nm process node

  • Author

    Dasnurkar, S. ; Datta, Amitava ; Abu-Rahma, M. ; Nguyen, Hien ; Villafana, M. ; Rasouli, H. ; Tamjidi, S. ; Ming Cai ; Sengupta, Sabyasachi ; Chidambaram, P.R. ; Thirumala, R. ; Kulkarni, Nandkumar ; Seeram, P. ; Bhadri, P. ; Patel, Pragati ; Sei Seung Yo

  • Author_Institution
    Qualcomm Inc., San Diego, CA, USA
  • fYear
    2013
  • fDate
    April 29 2013-May 2 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Mobile devices spend most of the time in standby mode. Supported features and functionalities are increasing in each newer model. With the wide spread adaptation of multitasking in mobile devices, retaining current status and data for all active tasks is critical for user satisfaction. Extending battery life in portable mobile devices necessitates the use of minimum possible energy in standby mode while retaining present states for all active tasks. This paper for the first time, explains the low voltage data-retention failure mechanism in flops. It analyzes the impact of design and process parameters on the data retention failure. Statistical nature of data retention failure is established and validated with extensive Monte-Carlo simulations across various process corners. Finally, silicon measurement from several 28nm industrial mobile chips is presented showing good correlation of retention failure prediction from simulation.
  • Keywords
    Monte Carlo methods; circuit simulation; elemental semiconductors; failure analysis; flip-flops; low-power electronics; silicon; statistical analysis; system-on-chip; Si; SoC; extensive Monte-Carlo simulation; flip-flop; impact design; industrial mobile chip; logic state retention; low voltage data-retention failure mechanism; portable mobile device; size 28 nm; statistical simulation; Correlation; Latches; Logic gates; Mobile communication; Monte Carlo methods; Silicon; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium (VTS), 2013 IEEE 31st
  • Conference_Location
    Berkeley, CA
  • ISSN
    1093-0167
  • Print_ISBN
    978-1-4673-5542-1
  • Type

    conf

  • DOI
    10.1109/VTS.2013.6548879
  • Filename
    6548879