DocumentCode
612974
Title
Experiments and analysis to characterize logic state retention limitations in 28nm process node
Author
Dasnurkar, S. ; Datta, Amitava ; Abu-Rahma, M. ; Nguyen, Hien ; Villafana, M. ; Rasouli, H. ; Tamjidi, S. ; Ming Cai ; Sengupta, Sabyasachi ; Chidambaram, P.R. ; Thirumala, R. ; Kulkarni, Nandkumar ; Seeram, P. ; Bhadri, P. ; Patel, Pragati ; Sei Seung Yo
Author_Institution
Qualcomm Inc., San Diego, CA, USA
fYear
2013
fDate
April 29 2013-May 2 2013
Firstpage
1
Lastpage
6
Abstract
Mobile devices spend most of the time in standby mode. Supported features and functionalities are increasing in each newer model. With the wide spread adaptation of multitasking in mobile devices, retaining current status and data for all active tasks is critical for user satisfaction. Extending battery life in portable mobile devices necessitates the use of minimum possible energy in standby mode while retaining present states for all active tasks. This paper for the first time, explains the low voltage data-retention failure mechanism in flops. It analyzes the impact of design and process parameters on the data retention failure. Statistical nature of data retention failure is established and validated with extensive Monte-Carlo simulations across various process corners. Finally, silicon measurement from several 28nm industrial mobile chips is presented showing good correlation of retention failure prediction from simulation.
Keywords
Monte Carlo methods; circuit simulation; elemental semiconductors; failure analysis; flip-flops; low-power electronics; silicon; statistical analysis; system-on-chip; Si; SoC; extensive Monte-Carlo simulation; flip-flop; impact design; industrial mobile chip; logic state retention; low voltage data-retention failure mechanism; portable mobile device; size 28 nm; statistical simulation; Correlation; Latches; Logic gates; Mobile communication; Monte Carlo methods; Silicon; System-on-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2013 IEEE 31st
Conference_Location
Berkeley, CA
ISSN
1093-0167
Print_ISBN
978-1-4673-5542-1
Type
conf
DOI
10.1109/VTS.2013.6548879
Filename
6548879
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