Title :
Contactless test access mechanism for TSV based 3D ICs
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Windsor, Windsor, ON, Canada
fDate :
April 29 2013-May 2 2013
Abstract :
In this paper, three coupling techniques for contactless TSV probing have been presented and their advantages and disadvantages are discussed. A contactless, noninvasive TSV probing scheme based on the principle of capacitive coupling is designed and simulated. The implemented scheme supports the high-density and the tight-pitch requirements for TSV probing.
Keywords :
circuit simulation; coupled circuits; integrated circuit design; integrated circuit testing; probes; three-dimensional integrated circuits; 3D IC; capacitive coupling technique; contactless noninvasive TSV probing scheme; contactless test access mechanism; high-density requirement; tight-pitch requirement; Capacitance; Couplings; Inductors; Probes; Three-dimensional displays; Through-silicon vias; Transmitting antennas; 3D stacked ICs; contactless probe; coupling techniques; test access mechanism; through silicon via;
Conference_Titel :
VLSI Test Symposium (VTS), 2013 IEEE 31st
Conference_Location :
Berkeley, CA
Print_ISBN :
978-1-4673-5542-1
DOI :
10.1109/VTS.2013.6548904
