• DocumentCode
    613004
  • Title

    Trading off area, yield and performance via hybrid redundancy in multi-core architectures

  • Author

    Yue Gao ; Yang Zhang ; Da Cheng ; Breuer, M.A.

  • Author_Institution
    Ming Hsieh Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    2013
  • fDate
    April 29 2013-May 2 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Manufacturing yield is a major concern for modern CMOS technologies. Fortunately, evolving chip architectures such as multi-cores have provided new venues for yield enhancement, and calls for a fresh perspective on the classic method of redundancy insertion. In this paper we outline a new approach towards redundancy insertion in modern multi-core CPU architectures. Traditionally, applying redundancy at a finer intra-core level of granularity provides great benefits in yield improvement, but requires additional steering logic and wiring that has a detrimental impact on area and performance. At the other end of the spectrum, coarse-grained core level redundancy can enable spare sharing, but it is only beneficial in highly-parallel GPU architectures. To this end, we will 1) introduce a hybrid spare sharing redundancy insertion scheme that combines the advantages of the above two approaches, while carefully leveraging the associated area and performance overheads, 2) present an extensively verified, systematic scalable model to evaluate the quality of the final design in terms of projected revenue per wafer, and 3) introduce a maximization algorithm to determine the near optimal redundancy configurations during the design stage. Experimental results show that our new design methodology provides more than 15% improvement in revenue per wafer, compared to using existing redundancy insertion techniques.
  • Keywords
    CMOS integrated circuits; multiprocessing systems; evolving chip architectures; finer intracore level; hybrid redundancy; manufacturing yield; modern CMOS technologies; multicore CPU architectures; multicore architectures; redundancy insertion; trading off area; yield enhancement; Complexity theory; Degradation; Delays; Multicore processing; Redundancy; Switches; System performance; Yield; hybrid redundancy; multi-core; performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium (VTS), 2013 IEEE 31st
  • Conference_Location
    Berkeley, CA
  • ISSN
    1093-0167
  • Print_ISBN
    978-1-4673-5542-1
  • Type

    conf

  • DOI
    10.1109/VTS.2013.6548909
  • Filename
    6548909