Peculiarities of multichip micro module frameless design with ball contacts on the flexible board

Author

Vertyanov, D.V. ; Tikhonov, K.S. ; Timoshenkov, S.P. ; Petrov, V.S. ; Blinov, G.A.

Author_Institution

Dept. of Microelectron., Nat. Res. Univ. of Electron. Technol., Moscow, Russia

fYear

2013

fDate

16-19 April 2013

Firstpage

417

Lastpage

419

Abstract

New design and technological solution of three-dimensional multi-chip modules has been considered. Installation of bare chips on a flexible board has been done by printed circuit board assembly and external module contacts have performed in the matrix ball pins form. Test program was conducted in order to quantify the limits of the process. Application of flip-chip process to a wide range of customers particularly for 3D packaging has been discussed.

Keywords

assembling; flip-chip devices; integrated circuit packaging; multichip modules; printed circuit design; 3D packaging; ball contact; chip installation; external module contact; flexible board; flip-chip process; matrix ball pins; multichip micromodule frameless design; printed circuit board assembly; test program; three-dimensional multichip module design; Assembly; Crystals; Flip-chip devices; Pins; Printed circuits; Random access memory; Reliability; flexible board; flip-chip; golden ball pins; multichip module; three-dimensional assembly;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and Nanotechnology (ELNANO), 2013 IEEE XXXIII International Scientific Conference

Conference_Location

Kiev

Print_ISBN

978-1-4673-4669-6

Type

conf

DOI

10.1109/ELNANO.2013.6552038

Filename

6552038