Title :
Peculiarities of multichip micro module frameless design with ball contacts on the flexible board
Author :
Vertyanov, D.V. ; Tikhonov, K.S. ; Timoshenkov, S.P. ; Petrov, V.S. ; Blinov, G.A.
Author_Institution :
Dept. of Microelectron., Nat. Res. Univ. of Electron. Technol., Moscow, Russia
Abstract :
New design and technological solution of three-dimensional multi-chip modules has been considered. Installation of bare chips on a flexible board has been done by printed circuit board assembly and external module contacts have performed in the matrix ball pins form. Test program was conducted in order to quantify the limits of the process. Application of flip-chip process to a wide range of customers particularly for 3D packaging has been discussed.
Keywords :
assembling; flip-chip devices; integrated circuit packaging; multichip modules; printed circuit design; 3D packaging; ball contact; chip installation; external module contact; flexible board; flip-chip process; matrix ball pins; multichip micromodule frameless design; printed circuit board assembly; test program; three-dimensional multichip module design; Assembly; Crystals; Flip-chip devices; Pins; Printed circuits; Random access memory; Reliability; flexible board; flip-chip; golden ball pins; multichip module; three-dimensional assembly;
Conference_Titel :
Electronics and Nanotechnology (ELNANO), 2013 IEEE XXXIII International Scientific Conference
Conference_Location :
Kiev
Print_ISBN :
978-1-4673-4669-6
DOI :
10.1109/ELNANO.2013.6552038
