Title :
3D IC cooling mechanism by using signaling vias
Author_Institution :
Microelectron. Dept., SEUA, Yerevan, Armenia
Abstract :
In this paper is discussed the problem of efficient thermal energy removal in 3D integrated circuits (IC) based on thermal via insertion in parallel with using existing signaling vias. This method allows to minimize the number of additional thermal vias and by this save useful area of chip.
Keywords :
cooling; integrated circuit interconnections; integrated circuit packaging; three-dimensional integrated circuits; 3D integrated circuit cooling mechanism; signaling vias; thermal energy removal; thermal via insertion; Algorithm design and analysis; Conferences; Cooling; Integrated circuits; Routing; Thermal energy; Three-dimensional displays; 3D IC; convex hull; locus; thermal via;
Conference_Titel :
Electronics and Nanotechnology (ELNANO), 2013 IEEE XXXIII International Scientific Conference
Conference_Location :
Kiev
Print_ISBN :
978-1-4673-4669-6
DOI :
10.1109/ELNANO.2013.6552044
